Ultrasonic Atomization Technology
Lingsko’s Ultrasonic Atomization Technology transforms molten solder alloys into highly spherical, ultra-pure solder powders through precise high-frequency vibration. This innovative process ensures uniform particle size, low oxidation, and excellent powder flowability.
Solder Powder
High-purity. Spherical. Consistent.
Produced through Ultrasonic Atomization Technology, Lingsko’s solder powder features perfectly spherical particles, narrow size distribution, and extremely low oxidation.
Its excellent flowability and uniformity make it ideal for solder materials, semiconductor packaging, and precision dispensing processes
Solder Paste
Consistency you can measure. Performance you can trust.
Formulated with ultrasonic-atomized solder powder and optimized flux systems, Lingsko’s solder paste provides excellent printability, uniform solder joints, and reliable wetting behavior for fine-pitch and precision electronic assembly.
Lingsko specializes in ultrasonic atomization technology, producing highly spherical, low-oxidation solder powder and solder paste for advanced electronic manufacturing and precision dispensing processes.
Lingsko – Precision Drives Quality · Technology Shapes the Future
We are committed to producing the finest solder materials through ultrasonic atomization technology and delivering them worldwide.
12
Years Experience
1,200+
Tons Annual Output
"Precision Defines Us — Innovation Drives Us”
30+
Product Types
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