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Sphericity
0.952
Spec > 0.900
▲ +5.8% above minimum
In-Range (15–25 μm)
95.2%
J-STD-005 Type 5 ≥ 80%
▲ Exceeds by 15.2 pts
Oxygen Content
100ppm
Spec < 150 ppm
↓ 33% below limit
Total Impurities
0.033%
Spec < 0.200%
↓ Only 16.5% of limit
Particle Size Distribution
2,138 particles analyzed · Avg. ⌀ 20.6 μm · IPC J-STD-005 Type 5
IPC J-STD-005 Type 5: ≥80% within 15–25 μm · ≤10% < 15 μm · <1% > 25 μm · none > 30 μm
Ultra-narrow distribution ensures consistent paste rheology, uniform solder joint volume, and stable printing performance across all batch sizes.
Ultra-narrow distribution ensures consistent paste rheology, uniform solder joint volume, and stable printing performance across all batch sizes.
Sphericity vs. Competing Technologies
Higher sphericity = better paste flow & printability at <0.3 mm pitch — critical for AI chip packaging
Ultrasonic Atomization
Industry Leading +5.8% above spec min
0.952
Lingsko Spec Minimum
Internal acceptance criterion
0.900
Typical Gas Atomization
Typical value, internal comparison
~0.850
Critical for fine-pitch SMT assembly, high-density BGA, and GPU/AI server board applications requiring consistent deposit volume and superior wettability.
// Chemical Composition — SAC305 Full Analysis (wt%)
| Element | Name & Role | Measured | Spec Limit | Status |
|---|---|---|---|---|
Sn | Tin — Base Metal Major | Balance | Balance | ✓ PASS |
Ag | Silver Major | 2.960% | 3.0% ± 0.2% | ✓ PASS |
Cu | Copper Major | 0.502% | 0.5% ± 0.2% | ✓ PASS |
Pb | Lead — RoHS Critical Impurity | 0.0035% | ≤ 0.0700% | ✓ PASS |
Bi | Bismuth Impurity | 0.0051% | ≤ 0.1000% | ✓ PASS |
Sb | Antimony Impurity | 0.0084% | ≤ 0.1000% | ✓ PASS |
Zn | Zinc Impurity | 0.0001% | ≤ 0.0010% | ✓ PASS |
Al | Aluminum Impurity | 0.0010% | ≤ 0.0010% | ✓ PASS |
As | Arsenic Impurity | 0.0025% | ≤ 0.0300% | ✓ PASS |
Au | Gold Impurity | 0.0002% | ≤ 0.0500% | ✓ PASS |
Cd | Cadmium Impurity | 0.0001% | ≤ 0.0020% | ✓ PASS |
Co | Cobalt Impurity | 0.0008% | ≤ 0.0500% | ✓ PASS |
Fe | Iron Impurity | 0.0039% | ≤ 0.0200% | ✓ PASS |
In | Indium Impurity | 0.0005% | ≤ 0.1000% | ✓ PASS |
Ni | Nickel Impurity | 0.0021% | ≤ 0.0100% | ✓ PASS |
P | Phosphorus Impurity | 0.0005% | ≤ 0.0500% | ✓ PASS |
S | Sulfur Impurity | 0.0019% | ≤ 0.0500% | ✓ PASS |
Se | Selenium Impurity | 0.0025% | ≤ 0.1000% | ✓ PASS |
| Σ Total Impurities | 0.0331% | ≤ 0.2000% | ✓ PASS | |
Limits per Lingsko internal specification, equal to or stricter than J-STD-006C; Pb also meets RoHS ≤ 0.1%.
Values shown are typical lot data — refer to the CoA supplied with each shipment.
Values shown are typical lot data — refer to the CoA supplied with each shipment.
Alloy Specification
AlloySn96.5Ag3Cu0.5
Solidus217 °C (423 °F)
Liquidus219 °C (426 °F)
Density~7.39 g/cm³
StandardJ-STD-006
Powder Specification
TypeType 5
Size Range15–25 μm
Avg. Diameter20.6 μm
Sphericity0.952 (measured)
O₂ Content< 150 ppm
Compliance & Applications
RoHSCompliant
REACHCompliant
PackagingN₂-sealed jar
ApplicationsSMT / BGA / Jetting
ProcessUltrasonic UAT