Lingsko is a national high-tech enterprise specializing in the R&D and manufacturing of SMT tin-based alloy solder powders, with a clear focus on AI servers, GPU accelerator boards, and data center electronics.

Lingsko operates an internationally advanced, fully enclosed, dust-free powder production system, covering the entire process from high-purity raw material selection, smelting, atomization, and particle classification to final packaging. This end-to-end control ensures exceptional purity, batch-to-batch consistency, and long-term process stability—key requirements for AI server-grade SMT assembly.

With an annual production capacity of 1,200 tons, Lingsko delivers reliable solder powder solutions designed for large BGA, thick PCB, high thermal mass, and long production runs, which are typical manufacturing conditions for AI and high-performance computing hardware.

Backed by a team of domestic and international industry experts, Lingsko continuously optimizes its processes and materials, with particular emphasis on AI Server Grade Type 5 solder powder, engineered for extreme stability rather than unnecessary fineness.

Lingsko is certified to ISO9001, ISO14001, and OHSAS18001, and strictly complies with international SMT solder powder standards. Beyond certification, the company emphasizes SPC-driven consistency, data-based quality control, and manufacturability-focused design, positioning its materials as a dependable foundation for next-generation AI hardware manufacturing.