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All Lingsko solder powders feature high sphericity, stable oxygen content, and narrow particle size distribution.
Available in Type 3 / 4 / 5 / 6 / 7 - custom mesh on request.
Ideal for SMT soldering, semiconductor packaging, and precision dispensing.
Lead-Free Solder Powder
SAC, SnAg and SnCu alloys for mainstream SMT, BGA and fine-pitch assembly.
SAC305
SAC405
SAC387
SAC105
SAC0307
SnAg3.5
SnCu0.7
Low-Temperature Solder Powder
Lead-free SnBi alloys for heat-sensitive components, flex circuits and step soldering.
Sn42Bi58
SnBi35Ag1
SnBi35Ag0.3
SnBi50
Tin-Lead Solder Powder
SnPb, SnPbAg and SnPbBi alloys for defense, aerospace and legacy assemblies.
Sn63Pb37
Sn60Pb40
Sn50Pb50
Sn62Pb36Ag2
Sn62.6Pb37Ag0.4
Sn43Pb43Bi14
High-Temperature Solder Powder
High-Pb and SnSb alloys for die attach, hierarchical (step) soldering and high-reliability joints.
Sn5Pb95
Sn10Pb90
Sn5Pb93.5Ag1.5
Sn2.5Pb95Ag2.5
Sn10Pb88Ag2
Sn5Pb85Sb10
SnSb10
SnSb5
Melting temperatures are typical solidus–liquidus values. Lot-specific data are reported on each Certificate of Analysis.
Powder Size Classification
Particle size distribution limits per IPC J-STD-005. Type 3–7 available in all alloy families; custom cuts on request.
| Powder Type | Nominal Rangemain fraction | None Larger Than | < 1% Larger Than | ≤ 10% Smaller Than | Meshreference | Typical Application |
|---|---|---|---|---|---|---|
| Type 3 | 25–45 µm≥ 80% in range | 50 µm | 45 µm | 20 µm | -325 / +500 | Standard SMT, ≥ 0.5 mm pitch |
| Type 4 | 20–38 µm≥ 90% in range | 40 µm | 38 µm | 20 µm | -400 / +635 | Fine pitch 0.4 mm, 0201, µBGA |
| Type 5Popular | 15–25 µm≥ 90% in range | 30 µm | 25 µm | 15 µm | -500 | Ultra-fine pitch 0.3 mm, 01005, CSP |
| Type 6 | 5–15 µm≥ 90% in range | 20 µm | 15 µm | 5 µm | — | Mini-LED, SiP, 008004 |
| Type 7 | 2–11 µm≥ 90% in range | 15 µm | 11 µm | 2 µm | — | Micro-LED, jet printing, wafer-level |
Quality Assurance
Every production lot is tested in-house before release. Values below are from SAC305 Type 5, lot 20260306C2.
ICP-OES Analysis
Measures Sn / Ag / Cu and 15 trace impurity elements, with detection limits down to 1 ppm, against IPC J-STD-006 composition and impurity limits.
Laser Diffraction PSD
Full particle size distribution for every lot, verified against the J-STD-005 limits for the ordered powder type.
SEM Sphericity
SEM image analysis confirms spherical shape and surface quality, critical for paste rheology and print release.
Oxygen Content
Inert-gas fusion analysis of surface oxide. Low oxygen improves wetting and reduces solder balling and voiding.
Technical Documentation
Request a Technical Data Sheet
Tell us the alloy and powder type you're evaluating. Our technical team will send the matching TDS and compliance documents.
What you'll receive
- Composition & impurity analysisPer IPC J-STD-006, from a representative lot COA
- Particle size distributionPer IPC J-STD-005 for the selected powder type
- Recommended reflow profilePeak temperature, time above liquidus, atmosphere
- SDS and RoHS / REACH declarationsReady for your supplier qualification file
