Powered by Ultrasonic Atomization Technology
All Lingsko solder powders feature high sphericity, stable oxygen content, and narrow particle size distribution.
Available in Type 3 / 4 / 5 / 6 / 7 - custom mesh on request.
Ideal for SMT soldering, semiconductor packaging, and precision dispensing.
Lead-Free Solder Powder
SAC / SnAg / SnCu series — RoHS & REACH compliant
Sn99Ag0.3Cu0.7
Melting Pt.~227 °C
StandardJ-STD-006
Sn98.5Ag1Cu0.5
Melting Pt.~222 °C
StandardJ-STD-006
Sn96.5Ag3Cu0.5
Melting Pt.217–220 °C
StandardJ-STD-006
Sn95.7Ag3.8Cu0.5
Melting Pt.217–219 °C
StandardJ-STD-006
Sn95.5Ag3.8Cu0.7
Melting Pt.217–219 °C
StandardJ-STD-006
Sn95.5Ag4Cu0.5
Melting Pt.217–220 °C
StandardJ-STD-006
Sn96.5Ag3.5
Melting Pt.221 °C
StandardJ-STD-006
Sn99Cu1
Melting Pt.~227 °C
StandardJ-STD-006
Type 3 / 4 / 5 available. Custom mesh on request.
Request datasheet →
Low-Temperature Solder Powder
Bi-based SnBi series — melting range 96–170 °C for temperature-sensitive assemblies
Sn42Bi58
Melting Pt.138 °C (eutectic)
ApplicationStep soldering
Sn50Bi50
Melting Pt.138–170 °C
ApplicationLow-temp reflow
Sn64.7Bi35Ag0.3
Melting Pt.~170 °C
ApplicationPoP / flex PCB
Sn64Bi35Ag1
Melting Pt.~170 °C
ApplicationPoP / flex PCB
Sn43Pb43Bi14
Melting Pt.96–150 °C
ApplicationRework / repair
N₂ atmosphere recommended during reflow.
Request datasheet →
Tin-Lead Solder Powder
SnPb and SnPbAg series — defense, aerospace, MIL-spec and legacy applications
Sn63Pb37
Melting Pt.183 °C (eutectic)
StandardJ-STD-006
Sn60Pb40
Melting Pt.183–190 °C
StandardJ-STD-006
Sn50Pb50
Melting Pt.183–215 °C
StandardJ-STD-006
Sn62.6Pb37Ag0.4
Melting Pt.179–189 °C
StandardMIL-P-38510
Sn62Pb36Ag2
Melting Pt.179–189 °C
StandardMIL-P-38510
Full COA and export compliance documentation provided.
Request datasheet →
High-Temperature Solder Powder
High-Pb and SnSb series — 240–320 °C for die attach and step soldering
Sn5Pb95
Melting Pt.308–312 °C
ApplicationDie attach
Sn10Pb90
Melting Pt.275–302 °C
ApplicationDie attach
Sn2.5Pb95Ag2.5
Melting Pt.~300 °C
ApplicationAerospace / MIL
Sn10Pb88Ag2
Melting Pt.268–290 °C
ApplicationStep soldering
Sn5Pb93.5Ag1.5
Melting Pt.296–301 °C
ApplicationMIL / die attach
Sn5Pb85Sb10
Melting Pt.240–256 °C
ApplicationStep soldering
Sn95Sb5
Melting Pt.232–240 °C
ApplicationPb-free Hi-T
Sn90Sb10
Melting Pt.245–252 °C
ApplicationHigh reliability
Aerospace & military exemptions apply. COC and full documentation provided.
Request datasheet →
Request Technical Data Sheet (TDS)
Secure full chemical composition lists, safety data, and reflow profile recommendations for specific alloys.
✓
Comprehensive Chemical Disclosure
✓
REACH & RoHS Compliance Docs
✓
Application-Specific Reflow Charts
✓ Request received — we'll send your TDS within 1 business day.
Powder Size Classification
| Alloy Type | Micron Range | Mesh Size | Application |
|---|---|---|---|
| Type 3 | 25 – 45 μm | -325 / +500 | Standard SMT |
| Type 4 | 20 – 38 μm | -400 / +635 | Fine Pitch |
| Type 5 | 15 – 25 μm | -500 / +1250 | Ultra-Fine Pitch |
| Type 6 | 5 – 15 μm | -1250+ | Mini-LED / SiP |
Quality Assurance
ICP-OES Analysis
Verifies alloy composition (Sn / Ag / Cu) and 16 trace impurity elements for every production lot, with detection limits down to 1 ppm. Required for IPC J-STD-006 compliance.
Laser Diffraction PSA
Laser diffraction particle size analysis measures the full particle size distribution of each production lot, verifying that powder meets IPC J-STD-005 Type 5 specifications (15–25 μm).