STN-GAG-525

Features

• Environmentally Friendly: Compliant with RoHS Directive 2002/95/EC

• Halogen-Free: Halogens undetected per EN14582 testing, achieving truly zero halogen content

Advantages

1. Excellent Dispensing Performance Fine, uniform paste consistency with smooth, uninterrupted flow. Maintains reliable dispensing performance for over 8 hours through needles as fine as 0.15mm.

2. High Reliability Halogen-free formulation rated IPC Class ROL0, with strong electrical performance ensuring outstanding product reliability.

3. Superior Process Adaptability Ready to use after returning to room temperature — no re-mixing required. Wide process window delivers exceptional soldering throughput, excellent appearance, and minimal defects.

4. Reduced Solder Balling Significantly minimizes the occurrence of random solder balls, reducing rework requirements and improving first-pass yield.

5. Excellent Thermal Slump Resistance Paste maintains its shape after pre-baking, ensuring full, bright solder joints while effectively reducing solder ball formation.

6. High Tack Strength Retains strong tack force after pre-baking, providing secure component hold and preventing displacement or dropout.

7. Low Residue Minimal post-reflow residue that is light in color, non-corrosive, and exhibits high surface insulation resistance.

Packaging

Available in syringes with net paste weight ranging from 30g to 1,500g per cartridge.

High-Temperature High-Lead Solder Paste for Semiconductor Applications

Product Overview

This solder paste is specially formulated for die attach processes in semiconductor manufacturing. Engineered for use with automated dispensing equipment, it delivers consistent paste volume and reliable performance.

The product leaves fully benign residues, which account for only 2% of paste weight or 20–25% of flux weight. This high-temperature, high-lead solder paste is halogen-free and complies with ANSI/J-STD-004, ANSI/J-STD-005, and Bellcore electromigration specifications.

Alloy Compositions

• Sn5/Pb95

• Sn5/Pb93.5/Ag1.5

• Sn5/Pb92.5/Ag2.5

• Sn10/Pb90

• Sn10/Pb88/Ag2

Packaging

Available in jar sizes of 35g, 100g, 500g, and 1,000g

Features & Advantages

1. Smooth, Stable Automatic Dispensing

• Ensures consistent solder output with minimal variation in viscosity.

• Supports high-precision automated dispensing processes.

2. Excellent Chemical Stability

• Suitable for long-duration needle transfer and dispensing operations.

• Meets the requirements for both dotting and printing processes.

3. Superior Solderability & Clean Residues

• Produces strong, reliable solder joints with very low void rates.

• Residues after soldering are easy to clean, contributing to high in-line production yields.

4. RoHS Exemption Compliant

• Lead content >85 wt.% qualifies as a high-lead solder under RoHS exemption.

• Designed for applications requiring high melting points and reliable metallurgical performance.

Application Scope

This product is a high-temperature, high-lead solder alloy designed for semiconductor device packaging. It is widely used in:

• Power transistors

• Diodes

• Triodes

• Rectifier bridges

• Small integrated circuits

• Other power semiconductor device packages

Its alloy demonstrates excellent compatibility with gold, copper, and silver, providing:

• Strong solder joint mechanical integrity

• High residue impedance

• Stable performance in high-power and high-reliability environments

Summary

This high-lead, high-melting-point solder material is ideal for demanding semiconductor packaging processes. With exceptional flow characteristics, strong wettability, and compliance with RoHS exemption requirements, it ensures consistent, reliable performance across a variety of power device applications.

The STN-MQ-T510 series is formulated with a specialized flux system and ultra-low oxygen spherical Sn/Ag/Cu alloy powder. It delivers outstanding continuous print resolution, while its highly reliable halogen-free activator system ensures excellent post-reflow residue performance — fully no-clean compatible with superior long-term reliability.

Key Features & Benefits

• Minimal viscosity change during continuous printing, ensuring exceptionally stable and consistent print results

• Fine-pitch printing capability for 0.4–0.6mm and larger pitch circuits with excellent definition

• Superior solderability with optimal wetting performance across varying component and board surface conditions

• Suitable for use in both air and nitrogen reflow atmospheres

• Maintains excellent solderability even at elevated peak reflow temperatures

T300 & T800 Lead-Free High-Temperature Solder Paste Series
The T300 and T800 series solder pastes are formulated using a special flux system combined with spherical Sn-Ag-Cu alloy powder with extremely low oxygen content. They deliver outstanding continuous printing resolution. In addition, the flux adopts a highly reliable halogen-free activator system, ensuring that even under no-clean conditions, post-reflow residues maintain excellent long-term reliability.

Product Features

1. Stable Viscosity During Continuous Printing
   Viscosity shows minimal change over time, enabling very stable and consistent printing performance.

2. High-Resolution Fine-Pitch Printing
   Capable of producing clean, precise print deposits for circuits with 0.4–0.6 mm pitch and above.

3. Excellent Solderability
   Provides appropriate wetting behavior across different component locations and pad types.

4. Compatible With Air or Nitrogen Reflow
   Suitable for both standard atmospheric reflow ovens and nitrogen reflow environments.

5. Reliable Performance at High Peak Temperatures
   Maintains strong soldering performance even under high-temperature reflow profiles.

1. LED Leaded Solder Paste

Suitable for LED bulbs, tube lights, LED backlight modules, outdoor display panels, flexible light strips, and high-power LED applications, providing excellent soldering performance.

2. LED Lead-Free Solder Paste

Suitable for LED bulbs, tube lights, LED backlight modules, outdoor display panels, and flexible light strips, delivering high-quality soldering results.

3. LED Medium-Temperature Solder Paste

Suitable for LED bulbs, tube lights, and high-power LED applications, providing superior soldering performance.

4. LED Low-Temperature Solder Paste

Ideal for LED bulbs, tube lights, and high-power LED modules, ensuring excellent soldering quality under low-temperature processing conditions.

5. LED Die-Attach Solder Paste

Designed for LED bulbs, tube lights, and high-power LED devices, offering outstanding bonding and soldering performance.

Lead-Free Medium- and Low-Temperature Solder Paste Series
The D42 series solder pastes are formulated using a specialized flux combined with spherical lead-free medium-temperature Sn-Bi-Ag alloy powder or lead-free low-temperature Sn-Bi alloy powder with extremely low oxygen content. They deliver excellent continuous printing resolution. In addition, the flux employs a highly reliable low-ion halogen activator system, ensuring that even under no-clean conditions, post-reflow residues maintain exceptional long-term reliability.

Product Features

1. Stable Viscosity During Continuous Printing
   Viscosity shows minimal change over time, enabling very stable and consistent printing performance.

2. High-Resolution Fine-Pitch Printing
   Capable of producing clean and precise print deposits for circuits with 0.4–0.6 mm pitch and above.

3. Excellent Solderability
   Provides suitable wetting performance across various pad types and component locations.

4. Compatible With Air or Nitrogen Reflow
   Suitable for both standard atmospheric reflow ovens and nitrogen-reflow environments.

5. Reliable Performance at High Peak Temperatures
   Achieves strong soldering performance even under high-temperature reflow conditions.

1. High-Activity Rosin-Type Solder Paste for Heatsinks (Developed by LINGSKO)

This solder paste is specially formulated for heatsink applications. It exhibits excellent wettability and is suitable for soldering highly oxidized copper surfaces. After reflow, it leaves minimal residue, and the remaining residue is transparent in appearance.

2. Sn42Bi58 Alloy Compatibility

The Sn42Bi58 alloy is compatible with a wide range of reflow equipment, including infrared, vapor phase, and hot-air convection systems.
The ideal heating rate is 2.5–3.0 °C/sec (most components have a maximum allowable heating rate of 4.0 °C/sec).

The Sn42Bi58 alloy is available in:

• Type 2 powder: 75–45 μm

• Type 3 powder: 45–25 μm

• Type 4 powder: 38–20 μm

• Type 5 powder: 25–15 μm (for precision dispensing applications)

The LED series solder paste is formulated using a specialized flux combined with spherical Pb-Sn alloy powder with extremely low oxygen content. It delivers excellent continuous printing resolution. In addition, the flux system utilizes a highly reliable low-ion halogen activator, ensuring that even under no-clean conditions, the post-reflow residues maintain outstanding long-term reliability.

• Stable Viscosity During Continuous Printing
  The viscosity changes very little over time, enabling highly stable and consistent printing.

• High-Resolution Fine-Pitch Printing
  Capable of producing clean, precise print results for circuits with 0.4–0.6 mm pitch and above.

• Excellent Solderability
  Provides suitable wetting behavior at various component locations and pad types.

• Compatible With Air or Nitrogen Reflow
  Can be used in standard atmospheric reflow ovens as well as nitrogen reflow environments.

• Reliable Performance at High Peak Temperatures
  Achieves strong soldering performance even under extremely high peak reflow temperatures.