Ultrasonic Atomization Technology
Sphericity
0.952
Standard > 0.900
▲ +5.8% above min
In-Range 15–25 μm
95.2%
Standard > 90%
▲ +5.2 pts
Oxygen Content
100ppm
Standard < 150 ppm
↓ 33% below limit
Total Impurities
0.032%
Standard < 0.200%
↓ 15.8% of limit
Particle Size Distribution — Area Statistics
SAC305 · Type 5 · 2,138 particles · Avg. ⌀ 20.6 μm
Area Distribution
Cumulative Distribution
100908070
60504030
20100
581013
15182023
253045
Particle Size (μm)
100908070
60504030
20100
D10: ~15.8 μm
D50: 20.6 μm
D90: ~23.4 μm
In-Range: 95.2%
IPC J-STD-005 Type 5 ✓
Our metallurgical supply chain spans 42 countries. Access localized support and expedited shipping.
Precision Network
Uncompromising Quality Controls
ISO 9001:2015
ISO 14001
OHSAS 18001
IPC Member
See You Next Year
Ultrasonic Atomization Technology
Lingsko’s Ultrasonic Atomization Technology transforms molten solder alloys into highly spherical, ultra-pure solder powders through precise high-frequency vibration. This innovative process ensures uniform particle size, low oxidation, and excellent powder flowability.
Our team"Precision Defines Us — Innovation Drives Us”
1200+
Tons Annual Output
30+
Product Types
4.9/5
Top-quality materials deliver
top-tier performance
Let’s begin the conversation.
Every customer has unique needs, and we specialize in customized Lingsko solder powder solutions. Have questions? Reach out anytime—or schedule a free consultation to get started.
