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Extreme Stability for AI Hardware Assembly

Lingsko AI Server Grade Type 5 is built for the realities of AI manufacturing.
Not finer for the sake of fineness, but more stable where it matters most.

Engineered for large BGA assembly on thick, high-thermal-mass PCBs, this Type 5 solder powder delivers consistent performance across batches and production shifts, helping AI hardware manufacturers move from trial-and-error to predictable, scalable production.

With extreme stability at its core, Lingsko AI Server Grade Type 5 turns solder powder from a process variable into a reliability enabler for AI servers and GPU platforms.

Designed for board-level high-density SMT

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Built for AI

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Designed for board-level high-density SMT · Built for AI ·

  • Geometric drawing of an outline square with sections divided by vertical, horizontal, and diagonal lines.

    Batch-to-batch consistency for long production cycles

  • Geometric drawing of an outline square with sections divided by vertical, horizontal, and half circle lines.

    Stable performance in extended print runs

  • Geometric drawing of an outline square with sections divided by vertical, horizontal, and circle lines.

    Optimized for GPU/AI server assembly conditions

  • Geometric drawing of an outline square with sections divided by vertical, horizontal, and diagonal lines.

    Focused on reliability and manufacturability

AI Server Grade

Extreme Stability for GPU & AI Server SMT
Consistent batches. Stable long runs. Predictable yields.

LET’S GET STARTED

Our team is ready to provide the attention, care, and expertise you deserve.