Utilizes high-frequency ultrasonic energy to convert molten solder alloys into fine, spherical metal droplets.
The process achieves superior sphericity, stable oxygen control, and uniform particle size distribution — setting a new benchmark in high-purity solder powder manufacturing.
This precisely controlled process produces high-purity, spherical tin powder with stable oxygen content, uniform size, and excellent flowability, providing a reliable foundation for advanced solder materials.
Powered by Ultrasonic Atomization Technology
Delivering High-Purity Tin Powder and Solder Paste Worldwide
Stable Oxygen Level / Controlled Inert Atmosphere / Rapid Cooling / High Sphericity
Advantages
High Sphericity: Perfectly round powder for optimal flowability.
Low Oxidation: Produced in an inert environment for clean metal surfaces.
Narrow Particle Size Distribution: Ensures consistent soldering performance.
Energy Efficiency: Lower energy use and quieter operation.
Environmentally Friendly: Reduced gas and dust emissions.
Applications
SMT solder powder
Semiconductor packaging materials
Solder paste formulations
Precision dispensing and micro-joining
Power module and heat sink assembly
Quality & R&D
Lingsko maintains a strict quality control process supported by advanced particle analysis, SEM imaging, and oxidation testing equipment.
Continuous R&D investment ensures ongoing improvement of ultrasonic atomization technology for future solder material innovations.
